Essemtec Fox is a proven surface-mount-technology (SMT) pick-and-place system that allows for printed circuit board (PCB) placement accuracy and speed, with high-quality engineering.
DragonFly IV® is a multi-material 3D printing system able to craft functional circuit boards and electronic devices within hours by simultaneously depositing proprietary conductive and dielectric substances, while integrating in-situ capacitors, antennas, coils, transformers, and electromechanical components.
Side-by-side they are a complete AME prototyping solution that accelerates the assemblyprocess, overcomes soldering challenges, protects IP, and creates supplementary internal synergy.
Combining AME & SMT maximizes R&D possibilities
DragonFly® IV
- PoC for 3D Hi-PEDs
- Build volume 160x160x3mm
- Conductive and dielectric inks
- Conductivity 30% ± 5%
- 75/100µm L/S
- 150µm VIA
- Low thickness variation <5%
- IST (IPC-650) over 300 thermal cycles (RT to 100°C)
- HATS (IPC-650) over 500 thermal cycles (0 to 70°C)
- Footprint: 1400x800x1800mm
FOX MFC
- Stand alone configuration
- 1 pick and place head
- More than 5000 cph
- Feeder package 8mm-24mm tape
- Tray for single component
- Solder paste jet value build in
- Dispensing speed up to 100,000 dph
- Case size 01005 (0.4×0.2mm)
- User-friendly SW, Gerber file import
- Footprint W/O hood 880x1090mm