Patents

Additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB’s together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each...

The disclosure relates to methods for direct and/or indirect inkjet printing of Electromagnetic Band Gap (EBG) elements having a structure of periodic mushroom-type cells enabling a reduced footprint for a very wide range of frequencies, for example between 500 MHz to about 30 GHz

The disclosure relates to computerized systems and methods for using additive manufacturing (AM) of simultaneous deposition of conductive and dielectric inks to form RC frequency pass filters having predetermined cutoff frequency with wide stop band frequency

The disclosure relates to methods and devices for a) mitigating warpage in printed circuit boards (PCBs) and high-frequency connect PCBs (HFCPs) with surface mounted chip packages (SMT) during reflow processing, and b) optional enclosing of the entire PCB with an encapsulating layer reflecting the negative image of the external layers populated PCB.

The disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns

The disclosure relates to fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

The disclosure relates to methods, systems and compositions for the fabrication of ceramic composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.

The disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA, SMT, and/or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.

The disclosure relates to continuous printing of colored resin and metallic composite components using inkjet printing

The disclosure relates to external, portable systems and jig assemblies for cleaning clogged nozzles of ink jet print head under controlled pressure. The jig assembly can be self-contained and detachable, and can be programmed to operate upon receiving various signals indicating clogged nozzle plate or portion thereof, and/or as a routine maintenance operating procedure.

The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles, or to methods and systems for sintering ink compositions with metal nanoparticles using an illumination source comprising an array of pulsed light emitting diodes (LEDs)

The disclosure relates to printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.

The disclosure relates to systems, methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

Systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic polymer derived interpenetrated networks that are comprised of at least two phases, or bi-continuous phases.

The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.

The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.

The disclosure relates to devices, systems and methods for contactless maintenance of inkjet print heads. Specifically, the disclosure relates to devices, systems and methods for removing purged ink from inkjet print head without contacting the aperture plate by drawing vacuum, with liquids or other mechanical means, such as wipes.

The disclosure relates to systems and methods for direct clean-in-place (CIP) of inkjet print heads. More particularly, the disclosure relates to systems and methods for facilitating CIP of inkjet print heads by selectably alternating the position of a mask disposed between the print head and a printing surface, between printing position, cleaning position and/or purging positions.

The disclosure relates to assemblies, kits and methods for alignment of inkjet print heads. More particularly, the disclosure relates to assemblies, kits and methods facilitating the alignment of inkjet printheads by selectably modulating the printheads' phase, registration, and yaw relative to the printing direction and optionally, with respect to an additional printhead or printheads.

The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets, and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets, and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets, and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets, and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.

Compositions for use in ink jet printing onto a substrate comprising a water based dispersion including metallic nano-particles and appropriate stabilizers. Also disclosed are methods for the production of said compositions and methods for their use in ink jet printing onto suitable substrates.

The invention relates to a method for preparing an aqueous-based dispersion of metal nanoparticles comprising: (a) providing an aqueous suspension of a metal salt; (b) pre-reducing the metal salt suspension by a water soluble polymer capable of metal reduction to form a metal nuclei; and (c) adding chemical reducer to form metal nanoparticles, and to compositions such as ink comprising such dispersions.

A device, system, and method for training or prediction of a neural network. A current value may be stored for each of a plurality of synapses or filters in the neural network. A historical metric of activity may be independently determined for each individual or group of the synapses or filters during one or more past iterations. A plurality of partial activations of the neural network may be iteratively executed. Each partial-activation iteration may activate a subset of the plurality of synapses or filters in the neural network. Each individual or group of synapses or filters may be activated in a portion of a total number of iterations proportional to the historical metric of activity independently determined for that individual or group of synapses or filters. Training or prediction of the neural network may be performed based on the plurality of partial activations of the neural network.

A device, system, and method for approximating a neural network comprising N synapses or filters. The neural network may be partially activated by iteratively executing a plurality of M partial pathways of the neural network to generate M partial outputs, wherein the M partial pathways respectively comprise M different continuous sequences of synapses or filters linking an input layer to an output layer. The M partial pathways may cumulatively span only a subset of the N synapses or filters such that a significant number of the remaining the N synapses or filters are not computed. The M partial outputs of the M partial pathways may be aggregated to generate an aggregated output approximating an output generated by fully activating the neural network by executing a single instance of all N synapses or filters of the neural network. Training or prediction of the neural network may be performed based on the aggregated output.

A device, system, and method for approximating a neural network comprising N synapses or filters. The neural network may be partially activated by iteratively executing a plurality of M partial pathways of the neural network to generate M partial outputs, wherein the M partial pathways respectively comprise M different continuous sequences of synapses or filters linking an input layer to an output layer. The M partial pathways may cumulatively span only a subset of the N synapses or filters such that a significant number of the remaining the N synapses or filters are not computed. The M partial outputs of the M partial pathways may be aggregated to generate an aggregated output approximating an output generated by fully activating the neural network by executing a single instance of all N synapses or filters of the neural network. Training or prediction of the neural network may be performed based on the aggregated output.

A device, system, and method is provided to mimic a pre-trained target model without access to the pre-trained target model or its original training dataset. A set of random or semi-random input data may be sent to randomly probe the pre-trained target model at a remote device. A set of corresponding output data may be received from the remote device that is generated by applying the pre-trained target model to the set of random or semi-random input data. A random probe training dataset may be generated comprising the set of random or semi-random input data and corresponding output data generated by randomly probing the pre-trained target model. A new model may be trained with the random probe training dataset so that the new model generates substantially the same corresponding output data in response to said input data to mimic the pre-trained target model.