Exciting AME Improvements Drive Multilayer PCB Manufacturing Forward

Additively Manufactured Electronics (AME) is increasingly playing a key role in electronics manufacturing for low-volume, high-complexity production and for rapid prototyping of complex electronics. With layer counts in PCBs for newer electronics continuing to increase, topping dozens of layers in extreme cases, a 3D, or additive manufacturing, system is a natural choice for complementing traditional PCB manufacturing capabilities and for rapid prototyping of complex electronics.

In addition to the geometric freedom afforded  designers and engineers,  using an additive manufacturing system for fabrication of multilayer PCBs makes sense from a business standpoint. Using a 3D printing system that is specialized for PCBs can be used to produce complex multilayer boards with reduced production time, less material waste, and competitive costs. This provides a higher throughput of low-volume, high-complexity electronics.

The reduced manufacturing time for extraordinarily complex multilayer PCBs makes additive manufacturing ideal for rapid prototyping of new electronic devices. Keeping this digital manufacturing system in-house eliminates the risks that come with sending a prototyping run overseas, keeps you cost-competitive, and allows immediate testing of finished prototypes. This hastens the overall R&D process and helps you get to market much faster.

Soldering: just one aspect of the multilayer PCB manufacturing process

Today, thanks to a continual investment in R&D and the incorporation of customer input, we have introduced several process and system improvements into the current DragonFly IV®

To address this evolving dynamic of 3D electronics printing, Nano Dimension pioneered AME in 2017 with the introduction of its first DragonFly machine. This unique additive manufacturing system allowed customers to quickly and digitally manufacture multilayer boards with complex architectures with lower cost and faster production time.

And while the concept was solid and the system proved ideal for certain electronics 3D printing, the initial DragonFly’s capabilities did not completely meet the needs and interests of this diverse and expanding market. The manufacturing sector and DragonFly customers provided honest, constructive feedback on what they were looking for in the next iteration AME system … and Nano Dimension listened!

Today’s DragonFly benefits from AI with Nano Dimension’s FLIGHT software and DeepCube technology. And exciting new materials and software enhancements for the system will be introduced in late 2023 as well.

The DragonFly IV is also fully compatible with standard surface-mount technology (SMT) — so when you couple the Nano Dimension – Essemtec – DragonFly Fox Bundle 2023, you have a complete in-house AME prototyping solution for Multilayer Boards (MLB) with HDI (High Density Interconnect) features. AME In-house prototyping reduces time-to-market, protects IP, fosters innovation, and creates supplementary internal synergy.

Read a  case study  or  contact us  today if you’re interested in learning more about the DragonFly IV system.