Products

Micro AM Materials

ATARU™

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A groundbreaking UV-curable
material for DLP-printing

ATARU™ is engineered for exceptional high-temperature
resistance and durability. ATARU™ also delivers excellent surface quality along with incredibly low dielectric loss.

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Market-leading thermal performance and durability

Suitable for injection molding & demanding environmental conditions

Signal Integrity Assurance

Unique low dielectric loss property ensures suitability for high-frequency electrical applications

Seamless integration

Low viscosity ensures compatibility with a wide range of DLP printers, enabling reliable printing and consistently high-quality results

Key Benefits

  • High thermal performance and durability
  • High impact strength
  • Ultra low loss
  • Excellent surface quality
  • Fast processing

Ideal Applications

  • Injection Molding
  • Molding under high pressure & temperature (carbon fiber molding)
  • Tooling & fixtures
  • Serial production (high speed curing time)
  • Radio frequency RF (antenna)

ATARU™ Properties

Viscosity~830 mPas (at 23° and 100 1/s)
ColorColor Cream Colored
ConditionStandardUnitValue
Tensile Modulus1 mm/minISO 527-1/-2MPa5640
Strain at break5 mm/minISO 527-1/-2%1.9
Stress at break5 mm/minISO 527-1/-2%73
Flexural Modulus1 %/minIPC-TM-650MPa5260
Flexural Strength1 %/minIPC-TM-650MPa132
Flexural Strain at break1 %/minIPC-TM-650%2.8
Izod impact strength unnotched+22°C / 1 JASTM D4812 : 2006J/m236
ConditionStandardUnitValue
CTE (0°C to 110°C)3 K/minIPC-TM-650 2.4.24.5µm/(m∙K)45.0
CTE (110°C to 200°C)3 K/minIPC-TM-650 2.4.24.5µm/(m∙K)72.6
CTE (200°C to 300°C)3 K/minIPC-TM-650 2.4.24.5µm/(m∙K)116.3
Td210 K/minIPC-TM-650°C351
Td510 K/minIPC-TM-650°C378
Tg10 K/minIPC-TM-650°C>300°C
HDT/B (0.45 MPa)FlatISO 75-2:2013-08°C>300°C
HDT/A (1.8 MPa)FlatISO 75-2:2013-08°C>300°C
HDT/C (8.0 MPa)FlatISO 75-2:2013-08°C133
ConditionStandardUnitValue
Thermal Conductivity25 °CW/mK0.28
Thermal Conductivity50 °CW/mK0.29
Thermal Conductivity100 °CW/mK0.31
Spec. Heat Capacity23 °CJ/gK0.97
Spec. Heat Capacity200 °CJ/gK1.5
ConditionStandardUnitValue
Water Absorption24 hASTM D 570%0.093
Resin

Recommended exposition time at 405nm under room temperature:

  • 2.7 mW/cm2: 5.7sec
  • 3 mW/cm2: 5.2sec
  • 5.5-16 mW/cm2: 2.1sec
  • Base layer: 10sec

Elevated temperature ease the release of large cross-sections. In case of flashing, add a delay before the exposition start.

1. Cleaning

The Recommended cleaning agent is the mixture *MMB:**water 70:30 (w:w). The maximum soaking time in the cleaning agent is 15 minutes then the parts can be rinsed with water.

*MMB: 3-Methoxy-3-methyl-1-butanol (MMB) / CAS: 56539-66-3 ; Available at Sigma
**Deionized preffered

2. Drying

Dry under pressurized air or in an oven at a temperature below 90°C.

3. UV Post-curing

Any type of UV treatment is suitable (no risk of overcuring). Examples:

  • 6x10s @50% (Hoenle UV Cube 100 IC)
  • 2×30 min (CureBox Wicked Engineering)
4. Thermal Post-treatment

Heat 2h at 200°C and cool down slowly. For bulky parts, slow heating must be applied to allow the material to be heated evenly before it starts to cure. The ramp is dependent on the thickness the parts.

Print Process
ATARU™ – 2 packages available for DLP systems: 1 liter and 5 liters
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